TAD-O-SI-1C

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TAD-P-SI-1C Silikonkleber thermisch leitfähig

TAD-O-SI-1C is an addition cure corrosion-free highly thermally conductive 1 part silicone adhesive. It cures at elevated temperature to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. The adhesive features high thermal conductivity and a thixotropic rheology that will prevent slumping or flow during the process. It allows for being operated at temperatures up to 210°C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where high thermal conductivity, adhesion, fast curing and controlled, precision application are essential.




PROPERTIES

  • Thermal conductivity: 2.1 W/mK
  • High bonding properties
  • Heat cure
  • Non corrosive
  • Thixotropic rheology preventing flow during the process
  • High operating temperatures up to 210°C
  • Extraordinary chemical resistance and longterm stability

AVAILABILITY

  • 1 kg jars
  • 310 ml cartridges
  • Bulk packaging options on request
  • Optional with glass beads
    e.g. 0.1 mm (TAD-O-SI-1CG100)

APPLICATION EXAMPLES

  • LED systems
  • Processor cooling
  • Memory chip assembly
  • CPU boards

OVERVIEW

PropertyUnitTAD-O-SI-1C
MaterialSilicone
ColourGrey
Specific Gravityg/cm³2.18
ViscosityPas140
HardnessShore A56
Tensile Strengthpsi2.20
Elongation%105
Curing Time (3 mm @ 125°C / @ 100°C)min10 / 116
Shelf Life (from Date of Manufacturing, unopened, @ 10 – 30°C / @ < 10°C)Months2 / 12
UL FlammabilityUL 94HB (1.5 mm, V0 6.0 mm)
RoHS Conformity2015 / 863 / EUYes
Thermal
Thermal ConductivityW/mK2.10
Coefficient of Thermal Expansion Volumetricx 10-6/K586
Coefficient of Thermal Expansion linearx 10-6/K195
Operating Temperature Range°C- 50 to + 210
Electric
Dielectric StrengthkV/mm> 18
Volume ResistivityOhm - cm> 3.5 x 1013