TFO-ZS-SI

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TFO-ZS-SI is a high performance electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with highly thermally conductive ceramic particles an extremely high thermal conductivity is reached. Its conformal surface structure and flexibility guarantees a very good compliance to the contact surfaces. Thus the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cutthrough resistance as well as easy handling.




PROPERTIES

  • Thermal conductivity: 8.0 W/mK
  • High surface compliance and flexibility
  • Excellent thermal contact
  • Outstanding mechanic stability through fibreglass reinforcement
  • Extraordinary chemical resistance and longterm stability
  • Residue-free removal after use

AVAILABILITY

  • Sheet 440 x 510 mm
  • Non tacky
    (TFO-ZSXXXX-SI)
  • Die cut parts

APPLICATION EXAMPLES

Thermal link of:

  • MOSFETs or IGBTs
  • Power diodes or AC/DC converters
  • Power modules

For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems

OVERVIEW

PropertyUnitTFO-ZS0200-SITFO-ZS0300-SITFO-ZS0450-SI
MaterialCeramic filled siliconeCeramic filled siliconeCeramic filled silicone
ColourWhiteWhiteWhite
ReinforcementFibreglassFibreglassFibreglass
Thicknessmm0.20±0,050.30±0,050.45±0,05
Tensile Strength1kpsi1.320.970.67
UL FlammabilityUL 94VOVOVO
RoHS Conformity2015 / 863 / EUYesYesYes
Thermal
Widerstand2 @ 150 PSI°C-inch²/W (mm)0.100.130.17
Widerstand2 @ 30 PSI°C-inch²/W (mm)0.150.190.24
Thermal Conductivity (X-Y Direction)W/mK8.08.08.0
Operating Temperature Range°C- 40 to + 180 - 40 to + 180 - 40 to + 180
Electric
Breakdown Voltage3kV AC3.64.55.0