TGL-W-SI
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TGL-W-SI is an electrically insulating thermally conductive, highly viscuous dispensable form-in-place gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. The ready-made compound does not require an additional crosslinking process. Due to the specific formulation and filling with ceramic particles the material has a very high thermal conductivity. After dispensing the viscoplastic material leads to an optimum thermal contact at no pressure. By its use the total thermal resistance is minimised.
PROPERTIES
- Dispensable
- Almost zero pressure at assembly due to viscoplasticity
- Thermal conductivity: 3.3 W/mK (ASTM D 5470) / 5.5 W/mK (Intern method)
- Ready-made, no additional crosslinking required
AVAILABILITY
- Cartridge 30 ml
- Pail 2 kg
- Others on request
APPLICATION EXAMPLES
Thermal link of:
- SMD packages
- Through-hole vias
- RDRAMs memory modules
- Flip Chips, DSPs, BGAs, PPGAs
For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs
OVERVIEW
| Property | Unit | TGL-W-SI |
|---|---|---|
| Material | Ceramic filled silicone compound | |
| Colour | Grey | |
| Density | g/cm³ | 3.1 |
| Viscosity (@ 10 1/min, 25 °C) | Pas | 500 |
| Penetration | mm/10 | 290 |
| RoHS Conformity | 2015 / 863 / EU | Yes |
| Thermal | ||
| Thermal Conductivity (ASTM D 5470) | W/mK | 3.3 |
| Thermal Conductivity (Intern method) | W/mK | 5.5 |
| Operating Temperature Range | °C | - 40 bis + 130 |
| Electric | ||
| Dielectric Strength | kV / mm | 7 |
| Volume Resistivity | Ohm - cm | 1,1 x 1014 |
