TAD-G-SI-1C

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TAD-G-SI-1C Silikonkleber thermisch leitfähig

TAD-G-SI-1C is a liquid addition cure corrosion-free highly thermally conductive 1 part silicone adhesive. It cures at elevated temperature over 100°C to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. The adhesive features good thermal conductivity. It allows for being operated at temperatures up to 260°C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where high thermal conductivity, adhesion, fast curing and controlled, precision application are essential.




PROPRIÉTÉS

  • Thermal conductivity: 1.38 W/mK
  • High bonding properties
  • Heat addition cure
  • Non corrosive
  • High operating temperatures up to 260°C
  • Extraordinary chemical resistance and longterm stability

DISPONIBILITÉ

  • 1 kg jars
  • 310 ml cartridges
  • Bulk packaging options on request
  • Optional with glass beads
    e.g. 0.2 mm (TAD-G-SI-1CG200)

EXEMPLES D'APPLICATION

  • LED systems
  • Processor cooling
  • Memory chip assembly
  • CPU board

OVERVIEW

EigenschaftEinheitTAD-G-SI-1C
MaterialSilikon
FarbeGrau
Spezifische Dichteg/cm³2,06
Lineare Schrumpfung%2,0
ViskositätPas43
HärteShore A67
ZugfestigkeitMPa3,1
Bruchdehnung%70
Aushärtung (@ 100°C)min30
Shelf Life (from Date of Manufacturing, unopened, @ < 15°C)Monate6
FlammabilityUL 94HB (1.5 mm)
RoHS Konformität2015 / 863 / EUJa
Thermisch
Thermische LeitfähigkeitW/mK1,38
Ausdehnungskoeffizient Volumetrischx 10-6/K562
Ausdehnungskoeffizient Linearx 10-6/K187
Betriebstemperaturbereich°C- 50 bis + 260
Elektrisch
DurchschlagsfestigkeitkV/mm22,5
DurchgangswiderstandOhm - cm7,7 x 1015
OberflächenwiderstandOhm - cm1,3 x 1015