TAD-O-SI-1C

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TAD-P-SI-1C Silikonkleber thermisch leitfähig

TAD-O-SI-1C is an addition cure corrosion-free highly thermally conductive 1 part silicone adhesive. It cures at elevated temperature to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. The adhesive features high thermal conductivity and a thixotropic rheology that will prevent slumping or flow during the process. It allows for being operated at temperatures up to 210°C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where high thermal conductivity, adhesion, fast curing and controlled, precision application are essential.




PROPRIÉTÉS

  • Thermal conductivity: 2.1 W/mK
  • High bonding properties
  • Heat cure
  • Non corrosive
  • Thixotropic rheology preventing flow during the process
  • High operating temperatures up to 210°C
  • Extraordinary chemical resistance and longterm stability

DISPONIBILITÉ

  • 1 kg jars
  • 310 ml cartridges
  • Bulk packaging options on request
  • Optional with glass beads
    e.g. 0.1 mm (TAD-O-SI-1CG100)

EXEMPLES D'APPLICATION

  • LED systems
  • Processor cooling
  • Memory chip assembly
  • CPU boards

OVERVIEW

EigenschaftEinheitTAD-O-SI-1C
MaterialSilikon
FarbeGrau
Spezifische Dichteg/cm³2,18
ViskositätPas140
HärteShore A56
ZugfestigkeitMPa2,20
Bruchdehnung%105
Aushärtung (3 mm @ 125 °C / @ 100 °C)min10 / 116
Shelf Life (from Date of Manufacturing, unopened, @ 10 – 30°C / @ < 10°C)Monate2 / 12
EntflammbarkeitUL 94HB (1.5 mm, V0 6.0 mm)
RoHS Konformität2015 / 863 / EUJa
Thermisch
Thermische LeitfähigkeitW/mK2,10
Ausdehnungskoeffizient Volumetrischx 10-6/K586
Ausdehnungskoeffizient Linearx 10-6/K195
Betriebstemperaturbereich°C- 50 bis + 210
Elektrisch
DurchschlagsfestigkeitkV/mm> 18
DurchgangswiderstandOhm - cm> 3,5 x 1013