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TFO-D-SI Silikonfolie glasfaserverstärkt

TFO-D-SI is an electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The material is characterised by its very high dielectric properties. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with self tackiness on one side with no need for an additional adhesive coating or with a one side adhesive coating.


  • Thermal conductivity: 1.2 W/mK
  • High thermal contact
  • Outstanding mechanic stability through fibreglass reinforcement
  • Very high dielectric strength
  • Extraordinary chemical resistance and longterm stability
  • Residue-free removal after use


  • Sheet 300 x 1000 mm
  • Roll 300 mm x 50 m
  • Non tacky (TFO-DXXX-SI)
  • Self tacky on one side without adhesive coating (TFO-DXXX-SI-AO)
  • One side adhesive (TFO-DXXX-SI-A1)
  • Die cut parts
  • Kiss cut parts on roll
  • Kiss cut parts on sheet


Thermal link of:

  • MOSFETs or IGBTs
  • Power diodes or AC/DC converters
  • Power modules

For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems


MaterialSilikon mit KeramikfüllungSilikon mit KeramikfüllungSilikon mit Keramikfüllung
EntflammbarkeitUL 94VOVOVO
RoHS Konformität2015 / 863 / EUJaJaJa
Widerstand2 @ 1 MPa°C-inch²/W0,550,751,25
Widerstand2 @ 200 kPa°C-inch²/W0,791,051,55
Thermische LeitfähigkeitW/mK1,21,21,2
Betriebstemperaturbereich°C- 50 bis + 180- 50 bis + 180- 50 bis + 180
Durchschlagsspannung3kV AC5,5> 6,0> 6,0
DurchgangswiderstandOhm - cm> 1,0 x 1011> 1,0 x 1011> 1,0 x 1011
Dielektrizitätskonstante@ 1 MHz6,06,06,0