TFO-G-SI

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TFO-G-SI Silikonfolie glasfaserverstärkt

TFO-G-SI is an electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The material is characterised by its very high dielectric properties. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with low tack pressure sensitive adhesive on one side.




PROPRIÉTÉS

  • Thermal conductivity: 1.6 W/mK
  • High thermal contact
  • Outstanding mechanic stability through fibreglass reinforcement
  • Very high dielectric strength
  • Extraordinary chemical resistance and longterm stability
  • Residue-free removal after use

DISPONIBILITÉ

  • Sheet
  • Roll 290 mm x 50 m
  • Non tacky
    (TFO-GXXX-SI)
  • Tacky on one side
    (TFO-GXXX-SI-A1)
  • Die cut parts
  • Kiss cut parts on sheet or roll

EXEMPLES D'APPLICATION

Thermal link of:

MOSFETs or IGBTs
Power diodes or AC/DC converters
Power modules

For use in Switch mode power supplies / Motor control units / High voltage hybrid automotive applications / PS units / Solar systems

OVERVIEW

EigenschaftEinheitTFO-G230-SI
MaterialSilikon mit Keramikfüllung
FarbeRosa
VerstärkungGlasfaser
Dickemm0,23+0,023 / -0,002
Zugfestigkeit1MPa20
EntflammbarkeitUL 94V0
RoHS Konformität2015 / 863 / EUJa
Thermisch
Widerstand2 @ 1 MPa°C-inch²/W0,49
Widerstand2 @ 200 kPa°C-inch²/W0,71
Thermische LeitfähigkeitW/mK1,6
Betriebstemperaturbereich°C- 50 bis + 180
Elektrisch
Durchschlagsspannung3kV AC5,5
DurchgangswiderstandOhm - cm1,0 x 1011