TFO-K-SI

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TFO-K-SI Silikonfolie glasfaserverstärkt

TFO-K-SI is an electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a very high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with low tack pressure sensitive adhesive on one side.




PROPRIÉTÉS

  • Thermal conductivity: 2.5 W/mK
  • High thermal contact
  • Outstanding mechanic stability through fibreglass reinforcement
  • Extraordinary chemical resistance and longterm stability
  • Residue-free removal after use

DISPONIBILITÉ

  • Sheet 320 x 1000 mm
  • Roll 320 mm x 50 m
  • Non tacky
    (TFO-K200-SI)
  • Tacky on one side
    (TFO-K200-SI-A1)
  • Die cut parts
  • Kiss cut parts on roll
  • Kiss cut parts on sheet

EXEMPLES D'APPLICATION

Thermal link of:

  • MOSFETs or IGBTs
  • Power diodes or AC/DC converters
  • Power modules

For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems

OVERVIEW

EigenschaftEinheitTFO-K200-SI
MaterialSilikon mit Keramikfüllung
FarbeGrau
VerstärkungGlasfaser
Dickemm0,23±0,05
Zugfestigkeit1MPa20
EntflammbarkeitUL 94VO
RoHS Konformität2015 / 863 / EUJa
Thermisch
Widerstand2 @ 1 MPa°C-inch²/W0,24
Widerstand2 @ 200 kPa°C-inch²/W0,47
Thermische LeitfähigkeitW/mK2,5
Betriebstemperaturbereich°C- 50 bis + 200
Elektrisch
Durchschlagsspannung3kV AC2,0
DurchgangswiderstandOhm - cm2,0 x 1014
Dielektrizitätskonstante@ 1 MHz4,0