TGF-ZP-SI

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TGF-ZP-SI Silikon Putty plastisch

TGF-ZP-SI is an electrically insulating thermally conductive silicone gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heigths must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has an extremely high thermal conductivity. Through its extreme softness and plasticity the material perfectly mates to irregular surfaces thus filling gaps at almost zero pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly.




PROPRIÉTÉS

  • Plastic
  • Extremely soft and compliable
  • Thermal conductivity: 11 W/mK
  • Operates at almost zero pressure
  • For minimal gaps
  • Extraordinary chemical resistance and longterm stability
  • Easy mounting through self tackiness

DISPONIBILITÉ

  • Sheet 300 x 200 mm
  • Tacky on both sides
    (TGF-ZPXXXX-SI)
  • Die cut parts
  • Kiss cut parts on sheet

EXEMPLES D'APPLICATION

Thermal link of:

  • SMD packages
  • Through-hole vias
  • RDRAMs memory modules
  • Capacitors

For use in Automotive applications / Laptops / Medicine engineering / Embedded boards

OVERVIEW

EigenschaftEinheitTGF-ZP1500-SITGF-ZP2000-SI
MaterialSilikon mit KeramikfüllungSilikon mit Keramikfüllung
FarbeHellgrauHellgrau
VerstärkungKeineKeine
Dickemm1,5+0,50 / -0,002,0+0,70 / -0,00
Dichteg/cm³3,33,3
EntflammbarkeitUL 94V0V0
RoHS Konformität2011 / 65 / EUJaJa
Thermisch
Widerstand1 @ 1,5 mm°C-inch²/W---0,24
Widerstand1 @ 0,8 mm°C-inch²/W0,140,14
Widerstand1 @ 0,5 mm°C-inch²/W0,100,10
Widerstand1 @ 0,2 mm°C-inch²/W0,060,06
Thermische LeitfähigkeitW/mK1111
Betriebstemperaturbereich°C- 50 bis + 180- 50 bis + 180
Elektrisch
DurchschlagsfestigkeitkV / mm1111
Dielektrizitätskonstante@ 1 MHz7,57,5
VolumenwiderstandOhm-cm7,0 x 1077,0 x 107