TGR-J-NS

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TGR-J-NS Silikonfreie Wärmeleitpaste hoch thermisch leitfähig

TGR-J-NS is high performing silicone-free thermal grease based on an ester oil matrix. It is ideal for use in applications where a very good and highly reliable thermal transfer must be achieved. Due to the specific formulation and filling with ceramic particles the material has a high thermal conductivity. By its use the thermal contact is maximised, hence the total thermal resistance is minimised.




PROPRIÉTÉS

  • Thermal conductivity: 2.0 W/mK
  • Silicone-free
  • Dispensable
  • Almost zero pressure at assembly
  • Dielectric strength
  • Operating temperature range: -40 to 150°C

DISPONIBILITÉ

  • Syringes 340 ml
  • Jars 1 kg

EXEMPLES D'APPLICATION

Thermal link of:

  • LED Boards
  • Power modules
  • RDRAMs memory modules
  • Flip Chips, DSPs , BGAs, PPGAs

For use in Automotive applications / Power electronics / Light technology / Industrial PCs

OVERVIEW

EigenschaftEinheitTGR-J-NS
MaterialKeramik gefüllte Wärmeleitpaste
FarbeWeiss
Dichteg / cm³3,1
Viskosität (Brookfield @ 10 rpm, 25 °C)Pas170
RoHS Konformität2015 / 863 / EUJa
Thermisch
Thermische LeitfähigkeitW/mK2,0
Betriebstemperaturbereich°C- 40 bis + 150
Lagertemperatur°C< 35 °C
Shelf Life (from Date of Manufacturing, unopened)Monate @ RT12
Elektrisch
DurchschlagsfestigkeitkV / mm5,0