TAD-U-SI-1C

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TAD-P-SI-1C Silikonkleber thermisch leitfähig

TAD-U-SI-1C is a condensation curing, non-corrosive highly thermally conductive 1 part silicone adhesive. It vulcanises at room temperature (RTV) to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. Due to rapid alcoxic curing while being in contact with atmospheric moisture it is solvent free. The adhesive features very high thermal conductivity and a thixotropic rheology that will prevent slumping or flow during the process. It allows for being operated at temperatures up to 230°C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where very high thermal conductivity, adhesion, fast curing and controlled, precision application are essential.




PROPRIETÀ

  • Thermal conductivity: 3.3 W/mK
  • High bonding properties
  • Cures at room temperature (RTV condensation cure)
  • Fast skinning
  • Non corrosive
  • Thixotropic rheology preventing flow during the process
  • High operating temperatures up to 230°C
  • Extraordinary chemical resistance and longterm stability

DISPONIBILITÀ

  • 310 ml cartridges
  • Bulk packaging options on request
  • Optional with glass beads

ESEMPI DI APPLICAZIONE

  • LED systems
  • Processor cooling
  • Memory chip assembly
  • CPU boards

OVERVIEW

EigenschaftEinheitTAD-U-SI-1C
MaterialSilikon
FarbeGrau
Spezifische Dichteg/cm³2.95
Extrusion Rateg/cm³104
HärteShore A84
ZugfestigkeitMPa264
Bruchdehnung%11
Tack Free Timemin10
Max. Cure (@ 25 °C)h48
Overlap Shear Strength (Al)kg/cm²13.1
E-ModulMPa3,330
Shelf Life (from Date of Manufacturing, unopened)Monate12
Max. Lagertemperatur°C40
FlammabilityUL 94V0
RoHS Konformität2015 / 863 / EUJa
Thermisch
Thermische LeitfähigkeitW/mK3.3
Betriebstemperaturbereich°C- 65 bis + 230
Elektrisch
DurchgangswiderstandOhm - cm1.26 x 1014