TAG-T-AC

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TAG

TAG-T-AC is a thermally conductive electrically insulating acrylate PSA tape. Through the thermally conductive adhesive the thermal contact is highly improved even at low pressures. Convex and concave surface structures and stack up tolerances are effectively compensated. Materials with different expansion coefficients can easily be bonded. Thus the total thermal resistance is minimised. The tape works well for realizing an effective and cost efficient thermal coupling in a broad field of applications. Above all it is used in applications having little space only and where the permitted weight is limited. Its wide thickness range allows for the use as gap filler.




PROPRIETÀ

  • Low thermal resistance
  • Thermal conductivity: 3.0 W/mK
  • Use as gap filler due to wide thickness range
  • Silicone-free
  • Neither mixing of components nor curing processes

DISPONIBILITÀ

  • Sheet
  • TAG-TXXXX-AC
  • Shaped parts
  • Optional soft type TAG-TXSXXXX-AC

ESEMPI DI APPLICAZIONE

Thermal link of:

  • LEDs
  • CPUs
  • RDRAM memory modules
  • Flip Chips, DSPs, BGAs, PPGAs
  • MOSFETs to heat sinks

For use in Power supplies / PCs / Telecom engineering / Automotive applications / LED arrays

OVERVIEW

EigenschaftEinheitTAG-T1000-ACTAG-T2000-AC
MaterialCeramic filled acry-late PSA adhesiveCeramic filled acry-late PSA adhesive
FarbeWeißWeiß
Tape Dickemm1,02,0
Liner Thickness:
Dual liner (Base / Top) or
Single liner
 
mm or
mm
 
0.05 / 0.05
0.14
 
0.05 / 0.05
0.14
Peel Off Strength (@ RT, Aluminium)N/cm5,95,9
Entflammbarkeit (Äquivalent)UL 94V0V0
RoHS Konformität2015 / 863 / EUJaJa
Thermisch
Widerstand1 @ 400 kPa @ Dicke°C-inch²/W (mm)0,34 (0,41)0,60 (0,75)
Widerstand1 @ 200 kPa @ Dicke°C-inch²/W (mm)0,45 (0,58)0,78 (1,03)
Widerstand1 @ 70 kPa @ Dicke°C-inch²/W (mm)0,56 (0,77)1,00 (1,43)
Thermische LeitfähigkeitW/mK2,5² / 3,0³2,5² / 3,0³
Betriebstemperaturbereich°C- 40 bis + 130- 40 bis + 130
Elektrisch
DurchschlagsspannungkVAC> 5.5> 5.5