TEL-ZS-SI

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TEL-YSS-SI Silikon Gap Filler hoch thermisch leitfähig

TEL-ZS-SI is a non dielectric high performance thermally conductive LV silicone foil for an optimised thermal coupling between electronic packages and heat sinks even over large gaps or big tolerances.Through the specific formulation and filling an extraordinary high anisotropic thermal conductivity is reached. Its conformal surface structure and high softness guarantee a very good compliance to the contact surfaces at low pressure. Thus the total thermal resistance is minimised.




PROPRIETÀ

  • High surface compliance and softness
  • Low volatile siloxane content (LV)
  • Non dielectric
  • Thermal conductivity: 20 W/mK (anisotropic)
  • Extraordinary chemical resistance and longterm stability
  • Shock absorbing

DISPONIBILITÀ

  • Sheet 120 x 120 mm
    (TEL-ZSXXXX-SI)
  • Die cut parts
  • Optional with adhesive stripes or dots
    (TEL-ZSXXXX-SI-A1)

ESEMPI DI APPLICAZIONE

Thermal link of:

  • MOSFETs or IGBTs
  • Power diodes or AC/DC converters
  • Power modules

For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems

OVERVIEW

EigenschaftEinheitTEL-ZS0200-SITEL-ZS0500-SI
MaterialCarbon filled silicone elastomereCarbon filled silicone elastomere
FarbeSchwarzSchwarz
Dickemm0,2±0,050,5±0,05
HärteShore 006060
Entflammbarkeit (Äquivalent)UL 94V0V0
RoHS Konformität2015 / 863 / EUJaJa
Thermisch
Widerstand1 @ 250 kPa @ Dicke°C-inch²/W (mm)0,007 (0,17)0,018 (0,44)
Widerstand1 @ 100 kPa @ Dicke°C-inch²/W (mm)0,0017 (0,18)0,027 (0,48)
Widerstand1 @ 50 kPa @ Dicke°C-inch²/W (mm)0,0030 (0,19)0,042 (0,49)
Thermische Leitfähigkeit1W/mK2020
Betriebstemperaturbereich°C- 40 bis + 150- 50 bis + 150
Elektrisch
DurchgangswiderstandOhm - cm< 50.000< 50.000