TGL-W-SI

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TGL-W-SI Silikon Gap Filler Putty dispensierbar

TGL-W-SI is an electrically insulating thermally conductive, highly viscuous dispensable form-in-place gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. The ready-made compound does not require an additional curing process. Due to the specific formulation and filling with ceramic particles the material has a very high thermal conductivity. After dispensing the viscoplastic material leads to an optimum thermal contact at no pressure. By its use the total thermal resistance is minimised.




PROPRIETÀ

  • Dispensable
  • Almost zero pressure at assembly due to viscoplasticity
  • Thermal conductivity: 5.5 W/mK
  • Ready-made, no additional curing required

DISPONIBILITÀ

  • Tube 250 g
  • Pail 2 kg
  • Others on request

ESEMPI DI APPLICAZIONE

Thermal link of:

  • SMD packages
  • Through-hole vias
  • RDRAMs memory modules
  • Flip Chips, DSPs, BGAs, PPGAs

For use in Automotive applications / Laptops / Medicine engineering / Industrial PCs

OVERVIEW

EigenschaftEinheitTGL-W-SI
MaterialKeramik gefüllter Silikoncompound
FarbeGrau
Dichteg/cm³3,1
Penetrationmm/10290
RoHS Konformität2015 / 863 / EUJa
Thermisch
Thermische LeitfähigkeitW/mK5,5
Betriebstemperaturbereich°C- 40 bis + 150
Elektrisch
DurchschlagsfestigkeitkV / mm10
DurchgangswiderstandOhm - cm1,0 x 1013