TPC-W-PC

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TPC-W-PC Phase Change Film

TPC-W-PC is thermally conductive phase changing film optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change compound starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at very low pressure. The particular formulation and the thixotropic nature prevents from run-out as well as migration. The material is available as TPC-W-PC as free standing film or with different substrates thus reworkability is improved since no compound residues remain on one side.




PROPRIETÀ

  • Optimal thermal contact
  • Thermal conductivity: 3.5 W/mK
  • Silicone-free
  • No migrating, pump-out or run out due to thixotropic properties
  • Ideal alternative and replacement of messy thermal grease
  • Different optional substrates allow for one-side residue-freeness and improved reworkability

DISPONIBILITÀ

  • Sheet 356 x 305 mm
  • Roll 356 mm (Liner 394 mm ) x L
    (up to 150 m)
  • TPC-WXXX-PC: Die cut parts
    between 2 release liners
  • One-side coated substrates:
    Aluminum TPC-WXXX-PC-ALYYY
    Copper TPC-WXXX-PC-CUYYY

ESEMPI DI APPLICAZIONE

Thermal link of:

  • MOSFETs or IGBTs
  • Memory modules
  • Power modules
  • CPUs

For use in Servo drive control units / Computers / Automation appliances / Microelectronics

OVERVIEW

EigenschaftEinheitTPC-W100-PCTPC-W200-PCTPC-300-PC
MaterialPhase Change FilmPhase Change FilmPhase Change Film
FarbeGrauGrauGrau
Dicke gesamtmm0,1+0,12 / -0,080,2+0,23 / -0,170,3+0,33 / -0,27
Dichteg/cm³2,02,02,0
RoHS Konformität2015 / 863 / EUJaJaJa
Thermisch
Widerstand1 @ 1 MPa°C-inch²/W0,00560,00610,0067
Widerstand1 @ 200 kPa°C-inch²/W0,00970,01030,0111
Widerstand1 @ 70 kPa°C-inch²/W0,01380,01480,0158
Thermische LeitfähigkeitW/mK3,53,53,5
Phase Change Temperatur°Cca. 45ca. 45ca. 45
LagerzeitMonate242424
Max. Lagertemperatur°C272727