TFO-G-SI

联系方式 下载 TFO-G-SI Data Sheet 样品订购


TFO-G-SI is an electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The material is characterised by its very high dielectric properties. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with low tack pressure sensitive adhesive on one side.




PROPERTIES

  • Thermal conductivity: 1.6 W/mK
  • High thermal contact
  • Outstanding mechanic stability through fibreglass reinforcement
  • Very high dielectric strength
  • Extraordinary chemical resistance and longterm stability
  • Residue-free removal after use

AVAILABILITY

  • Sheet
  • Roll 290 mm x 50 m
  • Non tacky
    (TFO-GXXX-SI)
  • Tacky on one side
    (TFO-GXXX-SI-A1)
  • Die cut parts
  • Kiss cut parts on sheet or roll

APPLICATION EXAMPLES

Thermal link of:

MOSFETs or IGBTs
Power diodes or AC/DC converters
Power modules

For use in Switch mode power supplies / Motor control units / High voltage hybrid automotive applications / PS units / Solar systems

OVERVIEW

PropertiesUnitTFO-G230-SI
MaterialCeramic filled silicone
ColourPink
ReinforcementFibreglass
Thicknessmm0,23+0,023 / -0,002
Tensile Strength1psi20
UL FlammabilityUL 94V0
RoHS Conformity2015 / 863 / EUYes
Thermal
Resistances2 @ 150 PSI°C-inch²/W0.49
Resistance2 @ 30 PSI°C-inch²/W0.71
Thermal ConductivityW/mK1.6
Operating Temperature Range°C- 50 to + 180
Electric
Breakdown Voltage3kV AC5.5
Volume ResistivityOhm - cm1,0 x 1011