TFO-K-SI

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TFO-K-SI is an electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a very high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The fibreglass reinforcement provides for an outstanding mechanic stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with low tack pressure sensitive adhesive on one side.




PROPERTIES

  • Thermal conductivity: 2.5 W/mK
  • High thermal contact
  • Outstanding mechanic stability through fibreglass reinforcement
  • Extraordinary chemical resistance and longterm stability
  • Residue-free removal after use

AVAILABILITY

  • Sheet 320 x 1000 mm
  • Roll 320 mm x 50 m
  • Non tacky
    (TFO-K200-SI)
  • Tacky on one side
    (TFO-K200-SI-A1)
  • Die cut parts
  • Kiss cut parts on roll
  • Kiss cut parts on sheet

APPLICATION EXAMPLES

Thermal link of:

  • MOSFETs or IGBTs
  • Power diodes or AC/DC converters
  • Power modules

For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems

OVERVIEW

PropertiesUnitTFO-K200-SI
MaterialCeramic filled silicone
ColourGrey
ReinforcementFibreglass
Thicknessmm0,23±0,05
Tensile Strength1psi20
UL FlammabilityUL 94VO
RoHS Conformity2015 / 863 / EUYes
Thermal
Resistances2 @ 150 PSI°C-inch²/W0.24
Resistance2 @ 30 PSI°C-inch²/W0.47
Thermal ConductivityW/mK2.5
Operating Temperature Range°C- 50 to + 200
Electric
Breakdown Voltage3kV AC2.0
Volume ResistivityOhm - cm2.0 x 1014
Dielectric Constant@ 1 MHz4.0