TAD-U-SI-1C

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TAD-P-SI-1C Silikonkleber thermisch leitfähig

TAD-U-SI-1C is a condensation curing, non-corrosive highly thermally conductive 1 part silicone adhesive. It vulcanises at room temperature (RTV) to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. Due to rapid alcoxic curing while being in contact with atmospheric moisture it is solvent free. The adhesive features very high thermal conductivity and a thixotropic rheology that will prevent slumping or flow during the process. It allows for being operated at temperatures up to 230°C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where very high thermal conductivity, adhesion, fast curing and controlled, precision application are essential.




PROPERTIES

  • Thermal conductivity: 3.3 W/mK
  • High bonding properties
  • Cures at room temperature (RTV condensation cure)
  • Fast skinning
  • Non corrosive
  • Thixotropic rheology preventing flow during the process
  • High operating temperatures up to 230°C
  • Extraordinary chemical resistance and longterm stability

AVAILABILITY

  • 310 ml cartridges
  • Bulk packaging options on request
  • Optional with glass beads

APPLICATION EXAMPLES

  • LED systems
  • Processor cooling
  • Memory chip assembly
  • CPU boards

OVERVIEW

PropertiesUnitTAD-U-SI-1C
MaterialSilicone
ColourGrey
Specific Gravityg/cm³2.95
Extrusion Rateg/cm³104
HardnessShore A84
Tensile Strengthpsi264
Elongation%11
Tack Free Timemin10
Max. Cure (@ 25 °C)h48
Overlap Shear Strength (Al)kg/cm²13.1
Young Moduluspsi3,330
Shelf Life (from Date of Manufacturing, unopened)Months12
Max. Storage Temperature°C40
FlammabilityUL 94V0
RoHS Conformity2015 / 863 / EUYes
Thermal
Thermal ConductivityW/mK3.3
Operating Temperature Range°C- 65 bis + 230
Electric
Volume ResistivityOhm - cm1.26 x 1014