PRODUCT OF THE MONTH – OCTOBER 2026
Large component tolerances and uneven surface geometries can significantly impact thermal performance in electronic systems. Our TGF-WP-SI Silicone Gap Filler is designed to bridge larger gaps while ensuring excellent heat transfer and reliable thermal contact, even at very low pressure.
- Electrically insulating & thermally conductive
- Thermal conductivity up to 6.0 W/mK
- Excellent conformability at low compression force
- Naturally tacky for easy pre-assembly
Its soft, plastically conformable structure adapts to component height variations and uneven surfaces, minimizing thermal interface resistance and supporting long-term system reliability. The material can also be supplied with adhesive layers or PI film reinforcement for simplified assembly. Discover how HALA thermal interface materials help engineers optimize heat dissipation and improve system performance. Looking for a highly conductive gap filler solution for challenging assemblies and large tolerances?
Let’s discuss how TGF-WP-SI can support your next thermal management project.
+49 7021 73141 79
Learn more:
